INDUCTO 2D - 二维电磁与热求解器

INDUCTO 2D^TM程序提供2D/RS域中的耦合电磁和热分析。OERSTED^TM的涡流模拟功能与KELVIN^TM的热分析功能相关联，可为感应加热问题提供解决方案。

INDUCTO 2D^TM可以执行瞬态和稳态仿真。此外，当不需要耦合仿真时，可以单独使用OERSTED^TM和KELVIN^TM模块。

使用INDUCTO 2D^TM设计人员可以：

• 确定模型内全部点的温度分布

• 计算感应线圈的有效电阻和电抗

• 计算感应加热系统的总功率要求

• 定制设计线圈以适应特定的感应加热应用

• 设计通量集中器、磁分流器和电磁屏蔽

• 研究瞬态加热和冷却状态的影响

特征：

• 适用于各种应用的3D射频和微波场求解器

• 有限差分时域求解器

• 我们的软件包包括：

• 求解器的选择：为确保您对解决方案有信心并进行独立验证，BEM和FEM方法都包含在同一个软件包中，以满足您的特定应用需求。并非每个求解器都适合每个应用程序，没有“一刀切”。

• 优化工具的选择：参数分析适用于那些需要快速方便优化且学习曲线短的人。API和脚本为高等用户提供了更多功能。这两种工具都在同一个包中。

• 内置材料库：自定义和创建您自己的库，以便方便访问您使用的材料。

• 与MATLAB®集成：用户的MATLAB代码可以包含对INTEGRATED API的函数调用，以构建几何、分配物理参数、求解和获得结果。

• 并行化：在64位计算机上使用时，可以充分利用可用RAM，从而显著提高求解速度和后处理速度。

• 直观的界面：可根据用户偏好定制（整体外观、工具栏、求解器、背景、默认值等）。

系统要求：

64位操作系统

Microsoft® Windows 10或更高版本

安装需要大约110MB的磁盘空间

二维程序：

至少需要4GB的RAM

尽管该软件在单处理器机器上运行，但在多处理器系统上运行它将使软件能够利用并行资源以并行方式求解。

【英文介绍】

INDUCTO 2D^TM program provides coupled electromagnetic and thermal analysis in the 2D/RS domain. The eddy current simulation capabilities of OERSTED^TM are linked to the thermal analysis capabilities of KELVIN^TM to provide a complete solution for induction heating problems.

INDUCTO 2D^TM can perform both transient and steady-state simulations. In addition, the OERSTED^TM and KELVIN^TM modules can be used separately when coupled simulations are not required.

Using INDUCTO 2D^TM designers can:

• Determine temperature distribution at all points within a model

• Calculate effective resistance and reactance of induction coils

• Calculate total power requirements for induction heating systems

• Custom design coils to accommodate specific induction heating applications

• Design flux concentrators, magnetic shunts and electromagnetic shields

• Investigate effects of transient heating and cooling regimes

Features

• 3D RF and microwave field solver for a diverse range of applications.

• Finite difference time domain solver.

• At no extra cost, our software packages include:

• Choice of solvers: To ensure you have confidence in the solution and for independent verification, both BEM and FEM methods are included in the same software package to suit your specific application needs. Not every solver fits every application, no "on size fits all".

• Choice of optimization tools: Parametric Analysis for those who need fast and easy optimization with a short learning curve. API and Scripting give more power to advanced users. Both tools are available in the same package.

• Built-in material libraries:Customize and create your own library for easy access to the materials you use.

• Integration with MATLAB®: Users' MATLAB code can include function calls to the INTEGRATED API to build geometry, assign physical parameters, solve, and obtain results.

• Parallelization: When used on 64-bit computers, this permits full utilization of the available RAM to dramatically increase speed of solution and post-processing.

• Intuitive interface that can be easily customized according to user preferences (overall appearance, toolbars, solvers, backgrounds, defaults, etc.)